Evolution of Semicon Chip Technology
07 December 2024
CSM have been supporting our customers in semiconductor industry for the last 28 years. Due to our active participation in semiconductor industry, we have the first hand opportunity to witness rapid evolution of semiconductor chips fabrication technology to fulfill process demand for line width reductions from 1um to 2nm over the past 30 years.
Below are Timeline of Semiconductor Line Width and Lithography Technology Evolution:
Key Highlights:
- Shift to Nano-Scale: The industry moved from microns to nanometers during the late 1990s, transitioning through enhanced deep ultraviolet (DUV) techniques.
- Introduction of EUV: Extreme ultraviolet (EUV) lithography became a critical enabler for sub-10 nm nodes, beginning around the 7 nm node.
- Current Cutting Edge: Manufacturers such as TSMC, Samsung, and Intel are deploying 3 nm processes, with 2 nm nodes under development for release by 2025.
- High-NA EUV: Beyond 2 nm, advancements like high-numerical-aperture (High-NA) EUV are in progress to address further scaling.
To prepare for future semiconductor demand, we are developing new generation CSM products with the new functionality, capability and character for semiconductor wafer fabrication. Below is example how CSM product is evolving from its application in general industry to semiconductor industry. Thanks to our CSM product development engineers for their creativity and dedication.
1. ADF for general industry
2. ADF for advanced industry like semiconductor and Biopharmaceutical
